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TEA5880TS
Integrated FM stereo radio IC for host processor tuning in handheld applications
Rev. 02 -- 26 April 2004 Preliminary data sheet
1. General description
The TEA5880TS stereo FM radio IC dramatically reduces the printed-circuit board area (only 100 mm2) needed to integrate FM radio functionality into portable devices. This makes it invaluable for any application where space is at a premium. Relying on a system host processor for radio tuning, the TEA5880TS is ideally suited for powerful devices such as PDAs, notebooks, portable CD and MP3 players.
2. Features
s s s s s s s s s s s s s s s s No alignments necessary Complete adjustment-free stereo decoder; no external crystal required Fully integrated MPX VCO circuit Fully integrated low IF selectivity and demodulation The full integration level means no or few external components required No external FM discriminator needed due to full integration Built-in adjacent channel interference total reduction (no 114 kHz, no 190 kHz) The level of the incoming signal at which the radio must lock is software programmable Due to new tuning concept, the tuning is independent of the channel spacing Very high sensitivity due to integrated low noise RF input amplifier RF Automatic Gain Control (AGC) circuit Standby mode for power-down, no power switch circuitry required 2.7 V minimum supply voltage MPX output for RDS 3-wire bus In combination with the host, fast, low power operation of preset mode, manual search, automatic search and automatic store are possible s Host can be in Sleep mode after tuning; a minute retuning is recommended to compensate for temperature and voltage fluctuations s Covers all Japanese, European and US bands.
Philips Semiconductors
TEA5880TS
Integrated FM stereo radio IC for host processor tuning
3. Quick reference data
Table 1: Quick reference data VCCA = VCCD Symbol VCCA VCCD ICCA ICCD ILED fFM(ant) Tamb Parameter analog supply voltage digital supply voltage analog supply current digital supply current optional stereo LED FM input frequency ambient temperature VCCA = VCC(VCO) = VCCD = 3 V VCCA = VCC(VCO) = VCCD = 5 V FM overall system parameters Vi(RF) RF sensitivity input voltage fRF = 76 MHz to 108 MHz; f = 22.5 kHz; fmod = 1 kHz; (S+N)/N = 26 dB; de-emphasis = 75 us; BAF = 300 Hz to 15 kHz; left = right fpilot = 6.75 kHz; f = 68.5 kHz 1 3 V operating standby operating standby Conditions Min 2.7 2.7 76 -10 -40 Typ 3.0 3.0 17 1 250 1 1 Max 5.0 5.0 22 100 500 100 2 108 +75 +85 Unit V V mA A mA A mA MHz C C
SUPpilot IP3in
pilot suppression in-band 3rd order intercept point at LNA input out-band 3rd order intercept point at LNA input LOW side 300 kHz selectivity HIGH side 300 kHz selectivity LOW side 200 kHz selectivity HIGH side 200 kHz selectivity image rejection
40 95 -
dB dBV
IP3out
-
95
-
dBV
S-300 S+300 S-200 S+200 IR VAUDL; VAUDR (S+N)/N
f = -300 kHz; fRF = 76 MHz to 108 MHz f = 300 kHz; fRF = 76 MHz to 108 MHz f = -200 kHz; fRF = 76 MHz to 108 MHz f = 200 kHz; fRF = 76 MHz to 108 MHz fRF = 76 MHz to 108 MHz
48
40 50 30 40 26 100 56
-
dB dB dB dB dB mV dB
left and right audio output VRF = 1 mV; left = right; f = 22.5 kHz; voltage fmod = 1 kHz maximum signal plus noise-to-noise ratio stereo channel separation VRF = 1 mV; left = right; f = 22.5 kHz; fmod = 1 kHz de-emphasis = 75 s; BAF = 300 Hz to 15 kHz VRF = 1 mV; right = 1 and left = 0 or right = 0 and left = 1; fmod = 1 kHz; fpilot = 6.75 kHz; fleft = 68.5 kHz and fright = 0 or fright = 68.5 kHz and fleft = 0
cs
15
25
-
dB
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Preliminary data sheet
Rev. 02 -- 26 April 2004
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Philips Semiconductors
TEA5880TS
Integrated FM stereo radio IC for host processor tuning
Table 1: Quick reference data ...continued VCCA = VCCD Symbol THD Parameter total harmonic distortion Conditions VRF = 1 mV; left = right; f = 75 kHz; fmod = 1 kHz; BAF = 300 Hz to 15 kHz VRF = 1 mV; left = right; f = 22.5 kHz; fmod = 1 kHz; BAF = 300 Hz to 15 kHz DEEM integrated de-emphasis Min Typ 0.7 0.2 50/75 Max 1.5 0.7 Unit % % s
4. Ordering information
Table 2: Ordering information Package Name TEA5880TS SSOP24 Description plastic shrink small outline package; 24 leads; body width 5.3 mm Version SOT340-1 Type number
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Preliminary data sheet
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Preliminary data sheet Rev. 02 -- 26 April 2004
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13022
5. Block diagram
Philips Semiconductors
MICROCONTROLLER reserved LR1 17 VCC1 18 VCC1 19 LL1 20 21 R/W 6 CLOCK 8 DATA 7
QUADRATURE OSCILLATOR
TUNING SYSTEM
DIGITAL INTERFACE LEVEL VOLTAGE GENERATOR
RFIN
1 QUADRATURE MIXER SELECTIVITY DEMODULATOR STEREO DECODER DE-EMPHASIS 50/75 s DE-EMPHASIS 15 kHz MIXER
10 11
AUDL
Integrated FM stereo radio IC for host processor tuning
AUDR
RFGND
2
STABILISATOR 5
POWER SWITCH 4 3, 13, 24
TEA5880TS
9
MPX
12 LED
14, 15, 16, 22, 23
001aaa665
VCCA VCCD GND
n.c.
TEA5880TS
Fig 1. Block diagram.
Depending on the antenna design the filter components at pins 1 and 2 may not be necessary. The only two remaining coils connected to pin 17 to 20 can be replaced by printed-circuit board traces that will fit underneath the TEA5880TS resulting in a design without any external components; see Section 14 for details on the printed-circuit board coils.
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Preliminary data sheet Rev. 02 -- 26 April 2004
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 13022
Philips Semiconductors
MICROCONTROLLER reserved LR1 17 VCC1 18 VCC1 19 LL1 20 21 R/W 6 CLOCK 8 DATA 7
QUADRATURE OSCILLATOR
TUNING SYSTEM
DIGITAL INTERFACE LEVEL VOLTAGE GENERATOR
RFIN RFGND
10 QUADRATURE MIXER SELECTIVITY DEMODULATOR STEREO DECODER DE-EMPHASIS 50/75 s DE-EMPHASIS 15 kHz MIXER 11
Integrated FM stereo radio IC for host processor tuning
AUDL AUDR
STABILISATOR 5
POWER SWITCH 4 3, 13, 24
TEA5880TS
9
MPX
12 LED
14, 15, 16, 22, 23
001aaa666
VCCA VCCD GND
n.c.
TEA5880TS
Fig 2. Block diagram (no external components).
5 of 27
Philips Semiconductors
TEA5880TS
Integrated FM stereo radio IC for host processor tuning
6. Pinning information
6.1 Pin description
Table 3: Symbol RFIN RFGND GND VCCD VCCA R/W DATA CLOCK MPX AUDL AUDR LED GND n.c. n.c. n.c. LR1 VCC1 VCC1 LL1 reserved n.c. n.c. GND Pin description Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Description RF input RF ground ground digital supply voltage analog supply voltage digital read/write command input bidirectional digital data line digital data clock line input FM MPX signal output audio left channel output audio right channel output stereo LED output ground not connected not connected not connected coil right internal analog voltage internal analog voltage coil left reserved for testing use not connected not connected ground
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Preliminary data sheet
Rev. 02 -- 26 April 2004
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Philips Semiconductors
TEA5880TS
Integrated FM stereo radio IC for host processor tuning
RFIN RFGND GND VCCD VCCA R/W DATA CLOCK MPX
1 2 3 4 5 6 7 8 9
24 GND 23 n.c. 22 n.c. 21 reserved 20 LL1
TEA5880TS
19 VCC1 18 VCC1 17 LR1 16 n.c. 15 n.c. 14 n.c. 13 GND
AUDL 10 AUDR 11 LED 12
001aaa667
Fig 3. Pin configuration.
7. Functional description
7.1 FM quadrature mixer
The FM quadrature mixer converts FM RF (76 MHz to 108 MHz) to an IF of 110 kHz. The FM quadrature mixer provides inherent image rejection.
7.2 Quadrature oscillator
The internally tuned LC VCO provides the Local Oscillator (LO) signal for the FM quadrature mixer. The VCO frequency range is 150 MHz to 217 MHz.
7.3 Selectivity
Fully integrated I and Q channel IF filter.
7.4 Demodulator
The FM quadrature demodulator is an integrated PLL demodulator.
7.5 Level voltage generator and analog-to-digital converter
The level voltage is analog-to-digital converted with 3 bits and output via the data line.
7.6 IF counter
The IF counter outputs a 16-bit count result via the data line.
7.7 Mute
The digital interface controls the audio mute and output level.
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Preliminary data sheet
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Philips Semiconductors
TEA5880TS
Integrated FM stereo radio IC for host processor tuning
7.8 Stereo decoder
The PLL stereo decoder is adjustment free. The stereo decoder can be switched to mono via the digital interface.
8. Digital interface (3-wire bus)
The TEA5880TS has a 3-wire bus with read/write, clock and data line. The register set of the TEA5880TS can be accessed via the digital interface. The pins given in Table 4 are defined for the digital interface of the TEA5880TS.
Table 4: Pin 6 Pin 8 Pin 7 Digital interface pins Name R/W CLOCK DATA Type input input input/output Description LOW is read from TEA5880TS; HIGH is write to TEA5880TS clock bidirectional data rising edge Remark
Pin number
R/W stereo LED stereo clock IF OSC FM OSC
OUTPUT SOURCE SELECTOR
CLOCK
R/W
15 BITS SIPO (SERIAL IN PARALLEL OUT) 4 bits data DATA ADDRESS DECODER 11 bits data CONTROL REGISTER A control bits
CONTROL REGISTER B CONTROL REGISTER C
control bits
control bits
REST OF THE REGISTERS
control bits
R/W
COUNTER 1 (16 bits) 16 bits data
STATUS REGISTER 16 bits data 1-bit data
001aaa668
enable counter 1
16 BITS PISO (PARALLEL IN SERIAL OUT) CLOCK R/W
Fig 4. Digital interface block diagram.
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Preliminary data sheet
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Philips Semiconductors
TEA5880TS
Integrated FM stereo radio IC for host processor tuning
8.1 Register description
Table 5: Address 0000b 0001b 0010b 0011b 0100b 0101b 0110b 0111b Table 6: Bit 14 to 11 10 to 6 5 4 to 0 Table 7: Bit 14 to 11 10 and 9 8 7 to 4 3 to 1 0
[1]
TEA5880TS registers description Register name VADC CTRL_C CTRL_A OSC_STEREO CTRL_B CAP_FM OSC_IF OSC_FM STATUS COUNTER Access write only write only write only write only write only write only write only write only read only read only Operation VADC register control register C control register A oscillator stereo decoder clock control register B capacitor bank FM oscillator IF oscillator FM status register counter register Data width 11 bits 11 bits 11 bits 11 bits 11 bits 11 bits 11 bits 11 bits 16 bits 16 bits Clocks 15 15 15 15 15 15 15 15 15 15
VADC - (address 0h) bit description Symbol VADC2[4:0] VADC1[4:0] Description address bits controls the width filter not applicable; should be written to logic 0 controls the center filter
CTRL_C - (address 1h) bit description [1] Symbol Description address bits reserved for production test; should be written to logic 0 reserved for swapping counters1 and 2; should be written to logic 0 not applicable; should be written to logic 0 reserved for time delay selection (counter 2); application should keep bits 3 to 1 at logic 0; see Table 8 reserved for enable counter 2; should be written to logic 0
The application should write logic 0 to this register at start-up to ensure that the device functions correctly.
Table 8: Value 000b 001b 010b 011b 100b 101b 110b 111b
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Time delay selection Decimal 0 1 2 3 4 5 6 7 Stop value count 2 count 8 count 32 count 128 count 512 count 2048 count 8192 count 32768
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Preliminary data sheet
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Philips Semiconductors
TEA5880TS
Integrated FM stereo radio IC for host processor tuning
CTRL_A - (address 2h) bit description Symbol OUTPUT_ SELECT[3:0] STE_PMUTE Description address bits selects an internal circuit as output for measurement purpose; see Table 10 mutes the stereo PLL when set to logic 1; this bit should be set during calibration of the stereo decoder clock and should be cleared during normal operation mutes the demodulator PLL when set to logic 1; this bit should be set during calibration of the IF frequency and should be cleared during normal operation turns off the stereo integrator loop when set to logic 0 enables measurement when set to logic 0 mutes the audio when set to logic 1 enables the FM circuitry when set to logic 1 reserved for AM circuitry; should be written to logic 0
Table 9: Bit 14 to 11 10 to 7 6
5
DEM_PMUTE
4 3 2 1 0 Table 10: Symbol OS-NONE
STE_INT_OFF# EN_MEAS# AMUTE FM -
Description of OUTPUT_SELECT bits Value 0000b 0001b 0010b 0011b 0100b 0101b 0110b 0111b 1000b 1001b 1010b 1011b 1100b 1101b 1110b 1111b Decimal 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Output selected no output selected FM oscillator not defined reserved for counter 2 ready output not defined stereo decoder clock not defined stereo LED not defined IF oscillator reserved for interrupt output PISO output (reading STATUS / COUNTER register) not defined reserved for RDS output not defined not defined
OS_FM_OSC OS_NA2 OS_CNT2_RDY_NA OS_NA4 OS_STEREO_DEC OS_NA6 OS_STEREO_LED OS_NA8 OS_IF_OSC OS_INTERRUPT_NA OS_PISO OS_NA12 OS_RDS_NA OS_NA14 OS_NA15 Table 11: Bit 14 to 11 10 to 0
[1]
OSC_STEREO - (address 3h) bit description [1] Symbol SO[10:0] Description address bits 11-bit digital-to-analog converter for adjusting the stereo decoder clock
The frequency is decreased when increasing the content of this register.
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Preliminary data sheet
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TEA5880TS
Integrated FM stereo radio IC for host processor tuning
CTRL_B - (address 4h) bit description Symbol L_CNT Description address bits latch counter: a transition from logic 1 to logic 0 will latch the COUNTER register into the PISO (reading the PISO hereafter will read the COUNTER register) latch status: a transition from logic 1 to logic 0 will latch the STATUS register into the PISO (reading the PISO hereafter will read the STATUS register) reserved for output level control; should be written with 4 (100b); see Table 13 de-emphasis: logic 1 is 75 s (USA), logic 0 is 50 s (Europe, Japan) a transition from logic 1 to logic 0 will clear the PISO; the PISO should be clear before reading the STATUS/COUNTER register a transition from logic 1 to logic 0 will clear both counter 1 and counter 2 counter 1 enabled (counting mode) when set to logic 1 should be written to logic 0 mono mode when set to logic 1, stereo mode when set to logic 0
Table 12: Bit 10 14 to 11 -
9
L_STS
8 to 6 5 4 3 2 1 0 Table 13: Value 0000b 0001b 0010b 0011b 0100b 0101b 0110b Table 14: Bit 10
DEEMP PISO_CLR CNT_RST CNT1_EN MONO
Description of output level control register bits Decimal 0 1 2 3 4 5 6 CAP_FM - (address 5h) bit description [1] Symbol Description address bits reserved for capacitor extra current; this bit should be written to logic 1 by any access to the CAP_FM to ensure that the device functions properly reserved, should be written to logic 0 FM capacitor bank switches for adjusting the FM (RF) frequency in big steps. Every bit, when set, will switch on a capacitor with a weight according to its position i.e. bit 0 has weight 1, bit 1 has weight 2, bit 2 has weight 4 etc, bit 6 has weight 64, except for bit 7, which also has the same weight as bit 6; there is thus only 712 effective bits; this means that the value range 0 to 127 will switch on different capacitors the value range 128 to 191 switches on the same capacitors as range 64 to 127, the value range 192 to 255 will switch on different capacitors (an overlapped range of 64 values caused when FC[7:6] = 01b or 10b) Output level 12 mV 20 mV 35 mV 60 mV 100 mV 170 mV 200 mV
14 to 11 -
9 to 8 7 to 0
FC[7:0]
[1]
The frequency is decreased when increasing the content of this register (more capacitors).
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Preliminary data sheet
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Philips Semiconductors
TEA5880TS
Integrated FM stereo radio IC for host processor tuning
OSC_IF - (address 6h) bit description [1] Symbol Description address bits
Table 15: Bit 10 to 0
[1]
14 to 11 -
IFO[10:0] 11-bit digital-to-analog converter for adjusting the IF frequency
The frequency is decreased when increasing the content of this register.
Table 16: Bit 10 to 0 14 to 11 -
OSC_FM - (address 7h) bit description [1] Symbol FO[10:0] Description address bits 11-bit digital-to-analog converter for adjusting the FM frequency in fine steps; this register is used in combination with the CAP_FM register to set a FM frequency
[1]
The frequency is increased when increasing the content of this register.
Table 17: Bit 15 to 9
STATUS - bit description [1] Symbol FS[6:0] Description field strength, indicated by the amount of bits set: 0 bits set = < 10 dBV 1 bit set = 10 dBV to 20 dBV 2 bits set = 20 dBV to 30 dBV 3 bits set = 30 dBV to 40 dBV 4 bits set = 40 dBV to 50 dBV 5 bits set = 50 dBV to 60 dBV 6 bits set = 60 dBV to 70 dBV 7 bits set = > 70 dBV
8 7 to 5 4 to 3 2 1 0
[1]
R[2:0] -
not applicable; always read as logic 1 chip revision; the revision for TEA5880TS is 100b not applicable; always read as logic 1 reserved for production test not applicable; always read as logic 1 reserved for production test
This register does not have an address. To read the status register, latch its content into the PISO (using L_STS bit in control register B) then read out the PISO.
Table 18: Bit 15 to 0
[1]
COUNTER - bit description [1] Symbol Description CNT[15:0] pulses counted during the period that the counter is enabled and the NR/W line the 3 wire bus is low
This register does not have an address. To read the counter register, latch its content into the PISO (using L_CNT bit in control register B) then read out the PISO.
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TEA5880TS
Integrated FM stereo radio IC for host processor tuning
8.2 Accessing the TEA5880TS
Access to the TEA5880TS can be achieved via the 3-wire bus. At the host side, the R/W and CLOCK are output signals, while the DATA signal is bidirectional. When powered up, the host should initialize the 3-wire bus in the host read mode as follows: 1. Set (at host side) the DATA line into input mode 2. R/W set to LOW 3. CLOCK set to LOW. Note: Use the following sequence for changing read/write mode: 1. To change from host read mode to host write mode proceed as follows: a. Keep the CLOCK signal LOW b. Set the R/W signal to HIGH (write mode) c. Set the DATA pin (of the application controller) into output mode. 2. To change from host write mode to host read mode proceed as follows: a. Keep the CLOCK signal LOW b. Set the DATA pin (of the application controller) into input mode c. Set R/W to LOW (input mode).
8.3 Writing to the TEA5880TS
Writing to the TEA5880TS is achieved with a 15-bit data pattern:
* D[14:11]: 4-bit register address * D[10:0]: 11-bit register data.
The data pattern is sent serially to the TEA5880TS as follows: 1. Drive R/W pin HIGH to set the TEA5880TS in input mode 2. Drive the DATA pin to correct level 3. Generate positive edge of CLOCK (driving CLOCK into LOW-to-HIGH transition) 4. Delay some time to meet the data hold time requirement 5. Driving CLOCK into HIGH-to-LOW transition 6. Repeat step (2) to (5) 15 times to shift the 15-bit data pattern into the TEA5880TS 7. Drive R/W pin LOW; this signals the TEA5880TS to latch the data into the correct register. Note: The application should shift the LSB out first.
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Preliminary data sheet
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Philips Semiconductors
TEA5880TS
Integrated FM stereo radio IC for host processor tuning
8.4 Reading from the TEA5880TS
Only the status or the counter register can be read from the TEA5880TS. These are 16-bit registers and can be read serially as follow: 1. Select OS_PISO (parallel in, serial out) as output (control register A, OUTPUT_SELECT bits) 2. Clear the PISO (control register B, PISO_CLR bit, pulse HIGH-to-LOW transition) 3. Latch the counter register (control register B, L_CNT bit, pulse HIGH-to-LOW transition) or the status register (control register B, L_STS bit, pulse HIGH-to-LOW transition) into the PISO 4. Drive R/W pin LOW to set the TEA5880TS in output mode 5. Read the first bit at pin DATA 6. Generate positive CLOCK pulse (LOW-to-HIGH transition) 7. Delay for a period of time to meet the data set-up time requirement 8. Read the data bit at pin DATA 9. Drive CLOCK into HIGH-to-LOW transition 10.Repeat step (6) to (9) 15 times to shift the remaining 15 bits of data out of the chip Note: The TEA5880TS will shift the MSB out first.
8.5 Measuring frequency with the TEA5880TS
The three frequencies: IF, stereo decoder clock and FM can be measured by using the counter register and a software timing window. This is achieved as follows: 1. Select the output to be measured (control register A, OUTPUT_SELECT bits, select OS_STEREO_DEC, OS_IF_OSC or OS_FM_OSC output) 2. Enable measure mode (clear EN_MEAS# bit of control register A) 3. Reset the counter (control register B, CNT_RST bit, pulse HIGH-to-LOW transition) 4. Start the counter on the TEA5880TS (control register B, set CNT1_EN bit); at the moment the R/W signal goes LOW the counter starts 5. Wait time t 6. To stop the counter, first set the R/W signal HIGH, then disable the counter in the TEA5880TS (control register B, clear CNT1_EN bit) 7. Read the pulse count n from the counter register of the TEA5880TS 8. Restore the measure mode 9. Restore the output select bits. Note: The measuring window begins at the moment the R/W signal is driven LOW (point 4) and ends when the R/W signal is driven HIGH (point 6).
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Philips Semiconductors
TEA5880TS
Integrated FM stereo radio IC for host processor tuning
The IF and stereo decoder frequency can be calculated using the equation f = n/t, and the FM frequency can be calculated using the equation f = (n/t) x 256. Note: The precision of `f' depends on the following:
* The duration of t. 1 pulse wrong at t = 1 ms results in more deviation than at t = 32 ms * The precision of the measuring window: calculate with t = 32 ms gives other `f' values
than with t = 32 ms. In the application care should be taken to have an accurate measuring window t.
8.6 Initialize the TEA5880TS
After power-up, the TEA5880TS needs to be initialized as follows:
* Control register A: STE_PMUTE = 1; DEM_PMUTE = 1; AMUTE = 1; FM = 1; other
bits = 0
* Control register B: CNT_RST = 1; PISO_CLR = 1; MONO = 1; DEEMP = 1 (for
Europe); Bit [8:6] = 100b; other bits = 0
* Control register C: All bits = 0 * VADC register: VADC1 = 26 (decimal), this value should not be changed hereafter;
VADC2 = 18 (decimal), this value should not be changed hereafter
* Calibrate the IF frequency at 110 kHz * Calibrate the stereo decoder clock at 37.5 kHz (to reduce the initialization time,
calibration of the stereo decoder clock can be postponed until the stereo mode is selected).
9. Timing diagrams
R/W
CLOCK 1 11 15
DATA LSB 11-bit data
MSB
LSB 4-bit address
MSB
001aaa669
Fig 5. Writing data.
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Philips Semiconductors
TEA5880TS
Integrated FM stereo radio IC for host processor tuning
R/W
CLOCK 0 15
DATA
LSB 16-bit data
MSB
001aaa670
Fig 6. Reading data.
enable FM OSC at output source selector enable internet clock set 16-bit counter clear reset 16-bit counter clear enable 16-bit counter to count timing width 8 ms to 100 ms disable 16-bit counter enable PISO at output source
001aaa671
Fig 7. Measuring sequence.
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TEA5880TS
Integrated FM stereo radio IC for host processor tuning
10. Limiting values
Table 19: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCCD VCCA Tstg Tamb Vesd Parameter digital supply voltage analog supply voltage storage temperature ambient temperature electrostatic discharge voltage for all pins VCCA = VCC(VCO) = VCCD = 3 V VCCA = VCC(VCO) = VCCD = 5 V
[1] [2]
Conditions
Min -0.3 -0.3 -55 -10 -40 -200 -2000
Max +5 +8 +150 +75 +85 +200 +2000
Unit V V C C C V V
[1] [2]
Machine model (R = 10 , C = 200 pF, 75 H). Human body model (R = 1.5 k, C = 100 pF).
11. Thermal characteristics
Table 20: Symbol Rth(j-a) Thermal characteristics Parameter Conditions Typ Unit K/W thermal resistance from junction to ambient in free air
12. Characteristics
Table 21: Symbol Digital inputs VIH VIL Digital outputs Isink (L) VOL Timing fclk tCLK(H) tCLK(L) clock input clock HIGH time clock LOW time 495 495 1 MHz ns ns LOW-level sink current LOW-level output voltage IOL = 500 A 500 0.6 A V HIGH-level input voltage LOW-level input voltage IOH = 500 A 1.4 0.6 V V Digital input AC values Parameter Conditions Min Typ Max Unit
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Philips Semiconductors
TEA5880TS
Integrated FM stereo radio IC for host processor tuning
20 dB 0
(1) (2)
001aaa673
-20
(3)
-40
(4)
-60 -10
(5)
30
70 RFIN (dBV)
110
(1) Mono signal. (2) Mono noise. (3) Stereo left. (4) Stereo right. (5) Stereo noise.
Fig 8. Signal characteristics.
5 THD (%) 4
001aaa674
3
2
1
0 -10
30
70 RFIN (dBV)
110
THD = 30 %.
Fig 9. Total harmonic distortion.
13. Components list
No external components necessary.
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TEA5880TS
Integrated FM stereo radio IC for host processor tuning
14. Printed-circuit board layout for SSOP24 package
The printed-circuit board traces from LL1 to VCC1 and from VCC1 to LR1 as shown in Figure 10, are to create two inductors, each of approximately 38 nH. These inductors, together with internal capacitors, form part of the LC oscillator to determine the FM tuning band. If the value of the inductors becomes much greater than 38 nH, the whole FM tuning band (normally from 76 MHz to 108 MHz) will be shifted lower. If the value of the inductors becomes much smaller than 38 nH, the whole FM tuning band (normally from 76 MHz to 108 MHz) will be shifted higher. If the layout of the two inductance traces is not preferred, two SMD inductors can be used to replace the two printed-circuit board inductance traces as an alternative. The layout of the two SMD inductors should be as close to the pins as possible.
RFIN RFGND GND VCCD V CCA R/W DATA CLOCK MPX AUDL AUDR LED 3.5 mm
GND n.c. n.c. reserved LL1 VCC1 VCC1 LR1 n.c. n.c. n.c. GND
001aaa675
3.5 mm
(1) Width of printed-circuit board trace = 0.15 mm; spacing between printed-circuit board trace = 0.15 mm. (2) Pins 14, 15, 16, 21, 22 and 23 are not connected.
Fig 10. Printed-circuit board layout.
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Preliminary data sheet
Rev. 02 -- 26 April 2004
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Philips Semiconductors
TEA5880TS
Integrated FM stereo radio IC for host processor tuning
15. Application information
FM antenna RFIN 1 2 3 VCCD
100 nF (1)
24 23 22 21 20 19 LL1 VCC1 VCC1 LR1
100 nF (1)
4 VCCA R/W DATA CLOCK MPX AUDL AUDR LED 5 6
TEA5880FM
7 8 9 10 11 12 18 17 16 15 14 13
001aaa672
(1) optional.
Fig 11. Application diagram.
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Preliminary data sheet
Rev. 02 -- 26 April 2004
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Philips Semiconductors
TEA5880TS
Integrated FM stereo radio IC for host processor tuning
16. Package outline
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1
D
E
A X
c y HE vMA
Z 24 13
Q A2 pin 1 index A1 (A 3) Lp L 1 e bp 12 wM detail X A
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 8.4 8.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 0.8 0.4 8 o 0
o
Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION SOT340-1 REFERENCES IEC JEDEC MO-150 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
Fig 12. Package outline.
9397 750 13022 (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 02 -- 26 April 2004
21 of 27
Philips Semiconductors
TEA5880TS
Integrated FM stereo radio IC for host processor tuning
17. Soldering
17.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended.
17.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept:
* below 225 C (SnPb process) or below 245 C (Pb-free process)
- for all BGA, HTSSON..T and SSOP..T packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages.
* below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
17.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
* Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
* For packages with leads on two sides and a pitch (e):
- larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;
9397 750 13022 (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 02 -- 26 April 2004
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Philips Semiconductors
TEA5880TS
Integrated FM stereo radio IC for host processor tuning
- smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end.
* For packages with leads on four sides, the footprint must be placed at a 45 angle to
the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
17.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
17.5 Package related soldering information
Table 22: Package [1] BGA, HTSSON..T [3], LBGA, LFBGA, SQFP, SSOP..T [3], TFBGA, USON, VFBGA DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC [5], SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L [8], PMFP [9], WQCCN..L [8]
[1] [2]
Suitability of surface mount IC packages for wave and reflow soldering methods Soldering method Wave not suitable not suitable [4] Reflow [2] suitable suitable
suitable not not recommended [5] [6] recommended [7]
suitable suitable suitable not suitable
not suitable
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible.
[3]
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Preliminary data sheet
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Philips Semiconductors
TEA5880TS
Integrated FM stereo radio IC for host processor tuning
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. Hot bar soldering or manual soldering is suitable for PMFP packages.
[5] [6] [7] [8]
[9]
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Preliminary data sheet
Rev. 02 -- 26 April 2004
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Philips Semiconductors
TEA5880TS
Integrated FM stereo radio IC for host processor tuning
18. Revision history
Table 23: Revision history Release date 20040426 Data sheet status Preliminary data sheet Change notice Order number 9397 750 13022 Supersedes Document ID TEA5880_2
9397 750 13022
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 02 -- 26 April 2004
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Philips Semiconductors
TEA5880TS
Integrated FM stereo radio IC for host processor tuning
19. Data sheet status
Level I II Data sheet status [1] Objective data Preliminary data Product status [2] [3] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
III
Product data
Production
[1] [2] [3]
Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
20. Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
21. Disclaimers
Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
22. Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
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Preliminary data sheet
Rev. 02 -- 26 April 2004
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Philips Semiconductors
TEA5880TS
Integrated FM stereo radio IC for host processor tuning
23. Contents
1 2 3 4 5 6 6.1 7 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 8 8.1 8.2 8.3 8.4 8.5 8.6 9 10 11 12 13 14 15 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pinning information . . . . . . . . . . . . . . . . . . . . . . 6 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6 Functional description . . . . . . . . . . . . . . . . . . . 7 FM quadrature mixer . . . . . . . . . . . . . . . . . . . . 7 Quadrature oscillator . . . . . . . . . . . . . . . . . . . . 7 Selectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Demodulator . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Level voltage generator and analog-to-digital converter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 IF counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Mute . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Stereo decoder . . . . . . . . . . . . . . . . . . . . . . . . . 8 Digital interface (3-wire bus). . . . . . . . . . . . . . . 8 Register description . . . . . . . . . . . . . . . . . . . . . 9 Accessing the TEA5880TS. . . . . . . . . . . . . . . 13 Writing to the TEA5880TS . . . . . . . . . . . . . . . 13 Reading from the TEA5880TS . . . . . . . . . . . . 14 Measuring frequency with the TEA5880TS . . 14 Initialize the TEA5880TS . . . . . . . . . . . . . . . . 15 Timing diagrams . . . . . . . . . . . . . . . . . . . . . . . 15 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 17 Thermal characteristics. . . . . . . . . . . . . . . . . . 17 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 17 Components list. . . . . . . . . . . . . . . . . . . . . . . . 18 Printed-circuit board layout for SSOP24 package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Application information. . . . . . . . . . . . . . . . . . 20 16 17 17.1 17.2 17.3 17.4 17.5 18 19 20 21 22 Package outline . . . . . . . . . . . . . . . . . . . . . . . . Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . Manual soldering . . . . . . . . . . . . . . . . . . . . . . Package related soldering information . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . Data sheet status. . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . 21 22 22 22 22 23 23 25 26 26 26 26
(c) Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 26 April 2004 Document order number: 9397 750 13022
Published in The Netherlands

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